Experts in Substrate Heating

Ceramics

At Thermic Edge, we pride ourselves on being at the forefront of the vacuum furnace industry. Providing a complete service, our bespoke versatile ranges gives you the tools necessary for any application.

Boron Nitride & Aluminium Nitride Ceramics

Boron Nitride is a material used for high-temperature applications with excellent thermal conductivity, high electrical resistance, low thermal expansion. Depending on the required application, they are used as precision components, coatings, powders, and lubricant additives in several different high-temperature applications and numerous industries: Semiconductor, LED, Photovoltaic, Vacuum Furnaces, Atomising, Horizontal Casting. PVD, Plasma Systems, Sintering and Powder metallurgy, Lubricant and Aluminum Casting.

 

BN50 

BN100 

BN200

BN300 

BNS26 

BNS40 

ZBN1000 

ABN1000 

PBN 

Macor 

Crystalline phase 

Hexagonal BN 

Hexagonal BN 

Hexagonal BN 99% 

Hexagonal BN> 99% 

BN-60% SiO2-40% 

BN-40% SiO2 60% 

BN-45% ZrO2-45% 

BN-72% Aln-23% Yttria-5% 

N / A 

N / A 

Binder phase / Binder type 

Boric Oxide 

calcium borate 

Boric Oxide 

Self bonded 

SiO2 

SiO2 

Borosilicates 

n / A 

CVD process 

Mica flakes 

Color 

White 

White 

White 

White 

White 

White 

Gray 

Gray 

Cream 

white 

Typical Applications 

General purpose 

Outstanding moisture resistance, refractory, dielectric strength 

High temperature and purity. Dielectric strength, low expansion, high thermal conductivity 

Extreme corrosion resistance, high purity temperature, thermal conductivity 

Extreme thermal conductivity, moisture resistance, dielectric strength 

Extreme thermal conductivity, moisture resistance, dielectric strength 

Extreme wear and corrosion resistance in molten metal applications 

Extreme high thermal conductivity and flexural strength comparable with Alumina 

Demanding applications when the very best purity, temperature is required such as MBE 

Low thermal conductivity, radiation resistance, can also be metallized 

Directionality  

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

Parallel / Perpendicular 

A&C direction 

n / A 

 

BN50 

BN100 

BN200

BN300 

BNS26 

BNS40 

ZBN1000 

ABN10000 

PBN 

Macor 

Flexural strength 

94/65 

59/45 

14/30 

22/21 

62/34 

103/76 

144/107 

300 

27500 PSI 

n / A 

Young Modulus 

47/74 

40/60 

n / A 

17/71 

N / A 

94/106 

71/71 

34.1 / 75.20 

n / A 

66.9 gpa 

RT compression 

143/186 

96 

n / A 

25th 

N / A 

317/289 

218/253 

1070 

37000 A direction 48,000 C direction units PSI 

345 mpa 

Open porosity 

2.84 

N / A 

15th 

19.3 

6.7 

6.88 

1,066 

Density (g / cc mm2) 

1.9 

1.9 

2.1 

2.3 

2.9 

2.9 

1.95 – 2.19 

2.52 

Hardness Knoop (KG / mm2) 

20th 

16 

4th 

N / A 

N / A 

100 

342 

n / A 

250 knobs 

 

BN50 

BN100 

BN200

BN300 

BNS26 

BNS40 

ZBN1000 

ABN10000 

PBN 

Macor 

Thermal conductivity @ 25 deg CW / mK 

30/34 

27/29 

21 

78/130 

12/29

12/14

24/34 

92.6 

0.25 “A” / 0.004 “C” 

1.46 

Coeff Thermal Expansion (10-6) 

          

25-400 C. 

3/3 

0.6 / 0.4  

n / A 

-2.3 / -0.7 

3.0 / 0.4 

1.5 / 0.2  

4.1 / 3.4 

n / A 

n / A 

93 x 10-7 

400-800 C. 

2 / 1.4 

1.1 / 0.8 

n / A 

-2.5 / 1.1 

2.5 / 0.1 

1.2 / 0.4 

5.6 / 4.3 

n / A 

0.001 “A” / 0.013 “C” 

n / A 

800 – 1200 C 

1.9 / 1.8 

1.5 / 0.9 

5.5 / 1 

1.6 / 0.4 

3.0 / 0.1 

1.2 / 0.4 

7.2 / 5.2 

n / A 

n / A 

n / A 

1200-1600 C. 

5 / 4.8 

2.8 / 2.7 

n / A 

0.9 / 0.3 

n / A 

n / A 

4.6 / 3.4 

0.57 / 0.46 

0.0025 “A” / 0.27 “C” 

n / A 

1600-1900 C. 

7.2 / 6.1 

n / A 

n / A 

0.5 / 0.9 

n / A 

n / A 

n / A 

n / A 

n / A 

n / A 

Specific heat at 25 ° CJ / gK 

8.60E-01 

8.10E-01 

n / A 

0.81 

0.77 

0.76 

0.64 

1.5 

0.2 cal / g * deg C 

n / A 

Max temp oxidizing / inert 

850/1200 C 

850 / 1150C 

850/1900 

850/2000 C. 

1000 C + 

1000 C + 

850/1600 C. 

1020/1900 

1900 

800-1000 

 

BN50 

BN100 

BN200 

BN300 

BNS26 

BNS40 

ZBN1000 

ABN10000 

PBN 

Macor 

Dieletric constant a @ 1 Mhz 

4.6 / 4.2 

4.3 / 4 

n / A 

4/4 

4.5 / 3.8 

3.4 / 3 3.7 

n / A 

7.1 

“C” 3.7 

6th 

Dissipation factor @ 1 Mhz 

1.2E-03 / 3.4E-03 

1.5E-03 / 2.1E-03 

n / A 

1.2E-03 / 3.0E-03 

1.7E-03 / 6.7E-03 

3.0E-03 / 3.1E-03 

n / A 

n / A 

n / A 

 

Dielectric strength Kv / mm 

88 

> 10 

> 70 

79 

66 

> 10 

n / A 

40 

“C” 230 

9.4 

RT resistivity (ohm cm) 

> 10 13> 10 14 

> 10 13> 10 13 

n / A 

> 10 13> 10 14 

> 10 13> 10 14 

> 10 14> 10 14 

> 10 13> 10 14 

n / A 

1 x 10 15 

> 10 16 

Boron Nitride Ceramics

OVERVIEW

BN can be offered in many forms including Powder, Paint, Paste, Aerosol, and in Hot pressed solid form.

Hot pressed boron nitride has a hexagonal structure like that of graphite.

Although HPBN is an insulator with outstanding properties in Temperature, Dielectric constant, Thermal shock, Thermal conductivity.

It can also be easily machined into intricate shapes with no post-firing necessary. Hot pressed boron nitride is a powder that is sintered at 2000 deg C plus. Depending on the process several grades can be selected for your requirement. Whether it’s extremely high-temperature high vacuum using no binder due to thermal extraction to moisture resistance using calcium borate glass as a binder. There is a grade of HPBN for most applications.

Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, Aluminum Nitride.

BN50
BN100
BN200
BN300
BNS26
BNS40
ZBN100
PBN

PROPERTIES

  • High electrical resistivity
  • High temperature material
  • Corrosion resistant
  • Excellent lubricating properties
  • Excellent thermal shock resistance
  • Good chemical inertness
  • High dielectric strength
  • High thermal conductivity
  • Low density
  • Non-wetting
  • Good machinability

APPLICATIONS

  • High voltage electrical insulators
  • Heat treatment insulators and fixture
  • Break rings for continuous casting of metals
  • Crucibles for high purity molten metals
  • High temperature lubricant
  • High temperature valves
  • Atomising Nozzles
  • Refractory applications
  • PVD insulators and shields
  • Insulating Stand offs
  • Vacuum furnace supports

PYROLYTIC BORON NITRIDE

PBN is a ceramic made by a chemical vapor deposition process which gives this material a very unique character. Intrinsically pure, it’s the ideal choice for furnace, electrical components, microwave, and Semiconductor applications.

Industry-standard crucibles such as VGF, LEC, Bridgman for Gallium Arsenide crystal production, and auxiliary effusion cell hardware. PBN/PG Heaters can also be manufactured to provide extremely uniform temperature profiles for both compound and semiconductor manufacturing. With bulk impurities at less than 100 parts per million and metallic impurities less than 10 parts per million, PBN will not react with acids, alkalis, organic solvents, molten metals, and graphites.

sPECIFICATIONS

Crystalline PhaseN/A
Binder Phase / Binder TypeCVD Process
ColourCream
Typical ApplicationsDemanding applications when the very best purity, temperature is required such as MBE
DirectionalityA & C Direction
 Mechanical Properties
Flexural Strength27,500 PSI
Young ModulusN/A
RT Compression3700 A Direction 48,000 C Direction Unites PSI
Open Porosity0
Density (kg/m³)1.95-2.19
Hardness-Knoop (kg/mm2)N/A
 Thermal Properties
Thermal Conductivity @ 25°C W/mK0.25 “A” / 0.004 “C”
Coefficient of Thermal Expansion (10-62) 
25°C – 400°CN/A
400°C – 800°C0.001 “A” / 0.013 “C”
800°C – 1200°CN/A
1200°C – 1600°C0.0025 “A” / 0.27 “C”
Specific Heat @ 25°C J/gK0.2 cal/g* deg C
Max Temperature Oxidising / Inert1900
 Electrical Properties
Dieletric Constant @ 1 Mhz“C” 3.7
Dissipation Factor @ 1 Mhzn/a
Dielectric Strength Kv/mm“C” 230
RT Resistivity (ohm cm)1 x 1015
Dieletric Constant a@ 1 Mhz“C” 3.7
Dissipation Factor @ 1 Mhzn/a
Dielectric Strength Kv/mm“C” 230
RT Resistivity (ohm cm)1 x 1015

HOT PRESSED BORON NITRIDE COMPOSITES

Hot Pressed Boron Nitride Composites change the Boron Nitride properties. Adding zirconia for molten metal applications such as break rings for horizontal casting or Silica for unparallel resistance to thermal shock and resistance to moisture and Aluminium nitride for excellent thermal properties.

Aluminium Nitride Ceramics

OVERVIEW

With its properties of electrical insulation and excellent thermal conductivity, Aluminium Nitride Ceramics is ideal for applications where heat dissipation is required.

In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon and excellent plasma resistance, it is used for semiconductor processing equipment components.

Power semiconductor devices – ideal substrate for active metal braze, power transistors, transformers with high capacity, and metallization.

Opto-electronics – high power and high-frequency microelectronic packages.

RF/Microwave components – thermal management requirements, Cable TV, Digital Amps, etc.

Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, Aluminum Nitride.

ABN100

ALUMINA CERAMICS

Alumina or Aluminium Oxide, Al2O3 is a major engineering material. It offers a combination of good mechanical properties and electrical properties leading to a wide range of applications.

Alumina can be produced in a range of purities with additives designed to enhance properties.

A wide variety of ceramic processing methods can be applied including machining or net shape forming to produce a wide variety of sizes and shapes of components. In addition, it can be readily joined to metals or other ceramics using metalizing and brazing techniques. Applications would be Semiconductor insulators, wear resistance components, and anything requiring superior mechanical, electrical, and thermal properties

SILICON NITRIDE

Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, high-strength ceramic material is used as an alternative to stainless steel, super alloys, tungsten carbides and first-generation ceramics such as Al2O3 and ZrO2.

It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials.

Machinable Glass Ceramics

OVERVIEW

MACOR can be joined or sealed to itself and other materials using epoxy–metalized parts can be soldered, and brazing is used to join various metals to MACOR. Sealing glass produces a reliable tight seal that can be used for high vacuum environments. With a high maximum operating temperature (1000°C under no load, 800°C continuous loads) and the flexibility of intricate shaping/precision during manufacture; MACOR offers a higher grade solution to your technical industry’s requirements.

Mykroy shares many properties with MACOR, acting as a highly versatile solution to expensive ceramics, being a more cost-effective option for less heat dependant solutions.

High Dielectric Strength Low-Loss Factor Heat Resisting Non-Tracking,  Low Expansion Co-Efficient, Strong and Rigid; does not creep or deform, unlike ductile materials, Low Thermal Conductivity; high-temperature insulator, Electrical Insulator, especially at high temperatures, Excellent with high voltages and a broad spectrum of frequencies, Zero Porosity, Radiation Resistant, No outgas in vacuum environments when baked out

Macor

SPECIFICATIONS

MACHINABLE GLASS PROPERTIES

 MYKROY MM500MACOR
Binder Phase/ Binder typeMica flakesMica flakes
ColourLight GreyWhite
Typical ApplicationsLow thermal conductivity and electrical properties. Does not burn or outgas, a cheaper alternative to Macor for high temperature work.Low thermal conductivity, radiation resistance, can also be metallised. A more expensive but versatile material than Mykroy.
Mechanical Properties
Flexural strength86.2 MPa94 MPa
Young Modulus (Modulus of Elasticity)82.7 GPa66.9 GPa
RT Compression345 MPa345 MPa
Open porosity0%0%
Density (g/cc mm2)2.72.52
Hardness90 / 46 Hv250 Knopp
Thermal Properties
Thermal conductivity @ 25 deg C W/mK1.151.46
Coeff Thermal Expansion (10^-6)  
 @ 25°C – 11.57 x 10^-6@ -100-25°C – 81 x 10^-7
 @ 350°C – 10.53 x 10^-6@ 25-300°C – 90 x 10^-7
 N/A@ 25-600°C – 112 x 10^-7
 N/A@ 25-800°C – 123 x 10^-7
Specific heat at 25°C  J/gK0.120.79 kJ/kg°C
Max Temp Oxidising / Inert500°C800°C – 1000°C
Electrical Properties
Dieletric constant, 25°C6.9 @ 1MHz

6.01 @ 1KHz

5.64 @ 8.5GHz

Dielectric strength Kv/mm20.945
RT resistivity (ohm.cm), 25°C>10^1410^17

MACOR COMPOSITION

Material

Approximate Weight
Silicon – SiO246%
Magnesium – MgO17%
Aluminium – AL2O316%
Potassium – K2O10%
Boron – B2O37%
Fluorine – F

4%

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