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Ceramics
At Thermic Edge, we pride ourselves on being at the forefront of the vacuum furnace industry. Providing a complete service, our bespoke versatile ranges gives you the tools necessary for any application.
Boron Nitride is a material used for high-temperature applications with excellent thermal conductivity, high electrical resistance, low thermal expansion. Depending on the required application, they are used as precision components, coatings, powders, and lubricant additives in several different high-temperature applications and numerous industries: Semiconductor, LED, Photovoltaic, Vacuum Furnaces, Atomising, Horizontal Casting. PVD, Plasma Systems, Sintering and Powder metallurgy, Lubricant and Aluminum Casting.
BN50 | BN100 | BN200 | BN300 | BNS26 | BNS40 | ZBN1000 | ABN1000 | PBN | Macor | |
Crystalline phase | Hexagonal BN | Hexagonal BN | Hexagonal BN 99% | Hexagonal BN> 99% | BN-60% SiO2-40% | BN-40% SiO2 60% | BN-45% ZrO2-45% | BN-72% Aln-23% Yttria-5% | N / A | N / A |
Binder phase / Binder type | Boric Oxide | calcium borate | Boric Oxide | Self bonded | SiO2 | SiO2 | Borosilicates | n / A | CVD process | Mica flakes |
Color | White | White | White | White | White | White | Gray | Gray | Cream | white |
Typical Applications | General purpose | Outstanding moisture resistance, refractory, dielectric strength | High temperature and purity. Dielectric strength, low expansion, high thermal conductivity | Extreme corrosion resistance, high purity temperature, thermal conductivity | Extreme thermal conductivity, moisture resistance, dielectric strength | Extreme thermal conductivity, moisture resistance, dielectric strength | Extreme wear and corrosion resistance in molten metal applications | Extreme high thermal conductivity and flexural strength comparable with Alumina | Demanding applications when the very best purity, temperature is required such as MBE | Low thermal conductivity, radiation resistance, can also be metallized |
Directionality | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | Parallel / Perpendicular | A&C direction | n / A |
BN50 | BN100 | BN200 | BN300 | BNS26 | BNS40 | ZBN1000 | ABN10000 | PBN | Macor | |
Flexural strength | 94/65 | 59/45 | 14/30 | 22/21 | 62/34 | 103/76 | 144/107 | 300 | 27500 PSI | n / A |
Young Modulus | 47/74 | 40/60 | n / A | 17/71 | N / A | 94/106 | 71/71 | 34.1 / 75.20 | n / A | 66.9 gpa |
RT compression | 143/186 | 96 | n / A | 25th | N / A | 317/289 | 218/253 | 1070 | 37000 A direction 48,000 C direction units PSI | 345 mpa |
Open porosity | 2.84 | N / A | 15th | 19.3 | 6.7 | 6.88 | 1,066 | 0 | 0 | 0 |
Density (g / cc mm2) | 2 | 2 | 1.9 | 1.9 | 2.1 | 2.3 | 2.9 | 2.9 | 1.95 – 2.19 | 2.52 |
Hardness Knoop (KG / mm2) | 20th | 16 | 5 | 4th | N / A | N / A | 100 | 342 | n / A | 250 knobs |
BN50 | BN100 | BN200 | BN300 | BNS26 | BNS40 | ZBN1000 | ABN10000 | PBN | Macor | |
Thermal conductivity @ 25 deg CW / mK | 30/34 | 27/29 | 21 | 78/130 | 12/29 | 12/14 | 24/34 | 92.6 | 0.25 “A” / 0.004 “C” | 1.46 |
Coeff Thermal Expansion (10-6) | ||||||||||
25-400 C. | 3/3 | 0.6 / 0.4 | n / A | -2.3 / -0.7 | 3.0 / 0.4 | 1.5 / 0.2 | 4.1 / 3.4 | n / A | n / A | 93 x 10-7 |
400-800 C. | 2 / 1.4 | 1.1 / 0.8 | n / A | -2.5 / 1.1 | 2.5 / 0.1 | 1.2 / 0.4 | 5.6 / 4.3 | n / A | 0.001 “A” / 0.013 “C” | n / A |
800 – 1200 C | 1.9 / 1.8 | 1.5 / 0.9 | 5.5 / 1 | 1.6 / 0.4 | 3.0 / 0.1 | 1.2 / 0.4 | 7.2 / 5.2 | n / A | n / A | n / A |
1200-1600 C. | 5 / 4.8 | 2.8 / 2.7 | n / A | 0.9 / 0.3 | n / A | n / A | 4.6 / 3.4 | 0.57 / 0.46 | 0.0025 “A” / 0.27 “C” | n / A |
1600-1900 C. | 7.2 / 6.1 | n / A | n / A | 0.5 / 0.9 | n / A | n / A | n / A | n / A | n / A | n / A |
Specific heat at 25 ° CJ / gK | 8.60E-01 | 8.10E-01 | n / A | 0.81 | 0.77 | 0.76 | 0.64 | 1.5 | 0.2 cal / g * deg C | n / A |
Max temp oxidizing / inert | 850/1200 C | 850 / 1150C | 850/1900 | 850/2000 C. | 1000 C + | 1000 C + | 850/1600 C. | 1020/1900 | 1900 | 800-1000 |
BN50 | BN100 | BN200 | BN300 | BNS26 | BNS40 | ZBN1000 | ABN10000 | PBN | Macor | |
Dieletric constant a @ 1 Mhz | 4.6 / 4.2 | 4.3 / 4 | n / A | 4/4 | 4.5 / 3.8 | 3.4 / 3 3.7 | n / A | 7.1 | “C” 3.7 | 6th |
Dissipation factor @ 1 Mhz | 1.2E-03 / 3.4E-03 | 1.5E-03 / 2.1E-03 | n / A | 1.2E-03 / 3.0E-03 | 1.7E-03 / 6.7E-03 | 3.0E-03 / 3.1E-03 | n / A | n / A | n / A | |
Dielectric strength Kv / mm | 88 | > 10 | > 70 | 79 | 66 | > 10 | n / A | 40 | “C” 230 | 9.4 |
RT resistivity (ohm cm) | > 10 13> 10 14 | > 10 13> 10 13 | n / A | > 10 13> 10 14 | > 10 13> 10 14 | > 10 14> 10 14 | > 10 13> 10 14 | n / A | 1 x 10 15 | > 10 16 |
BN can be offered in many forms including Powder, Paint, Paste, Aerosol, and in Hot pressed solid form.
Hot pressed boron nitride has a hexagonal structure like that of graphite.
Although HPBN is an insulator with outstanding properties in Temperature, Dielectric constant, Thermal shock, Thermal conductivity.
It can also be easily machined into intricate shapes with no post-firing necessary. Hot pressed boron nitride is a powder that is sintered at 2000 deg C plus. Depending on the process several grades can be selected for your requirement. Whether it’s extremely high-temperature high vacuum using no binder due to thermal extraction to moisture resistance using calcium borate glass as a binder. There is a grade of HPBN for most applications.
Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, Aluminum Nitride.
PBN is a ceramic made by a chemical vapor deposition process which gives this material a very unique character. Intrinsically pure, it’s the ideal choice for furnace, electrical components, microwave, and Semiconductor applications.
Industry-standard crucibles such as VGF, LEC, Bridgman for Gallium Arsenide crystal production, and auxiliary effusion cell hardware. PBN/PG Heaters can also be manufactured to provide extremely uniform temperature profiles for both compound and semiconductor manufacturing. With bulk impurities at less than 100 parts per million and metallic impurities less than 10 parts per million, PBN will not react with acids, alkalis, organic solvents, molten metals, and graphites.
| Crystalline Phase | N/A |
| Binder Phase / Binder Type | CVD Process |
| Colour | Cream |
| Typical Applications | Demanding applications when the very best purity, temperature is required such as MBE |
| Directionality | A & C Direction |
| Mechanical Properties | |
| Flexural Strength | 27,500 PSI |
| Young Modulus | N/A |
| RT Compression | 3700 A Direction 48,000 C Direction Unites PSI |
| Open Porosity | 0 |
| Density (kg/m³) | 1.95-2.19 |
| Hardness-Knoop (kg/mm2) | N/A |
| Thermal Properties | |
| Thermal Conductivity @ 25°C W/mK | 0.25 “A” / 0.004 “C” |
| Coefficient of Thermal Expansion (10-62) | |
| 25°C – 400°C | N/A |
| 400°C – 800°C | 0.001 “A” / 0.013 “C” |
| 800°C – 1200°C | N/A |
| 1200°C – 1600°C | 0.0025 “A” / 0.27 “C” |
| Specific Heat @ 25°C J/gK | 0.2 cal/g* deg C |
| Max Temperature Oxidising / Inert | 1900 |
| Electrical Properties | |
| Dieletric Constant @ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
| Dieletric Constant a@ 1 Mhz | “C” 3.7 |
| Dissipation Factor @ 1 Mhz | n/a |
| Dielectric Strength Kv/mm | “C” 230 |
| RT Resistivity (ohm cm) | 1 x 1015 |
Hot Pressed Boron Nitride Composites change the Boron Nitride properties. Adding zirconia for molten metal applications such as break rings for horizontal casting or Silica for unparallel resistance to thermal shock and resistance to moisture and Aluminium nitride for excellent thermal properties.
With its properties of electrical insulation and excellent thermal conductivity, Aluminium Nitride Ceramics is ideal for applications where heat dissipation is required.
In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon and excellent plasma resistance, it is used for semiconductor processing equipment components.
Power semiconductor devices – ideal substrate for active metal braze, power transistors, transformers with high capacity, and metallization.
Opto-electronics – high power and high-frequency microelectronic packages.
RF/Microwave components – thermal management requirements, Cable TV, Digital Amps, etc.
Thermic Edge does not just offer Boron Nitride and composites but also Mykroy, Alumina Silicate, Macor Alumina, Silicon Nitride, Zirconia, Aluminum Nitride.
Alumina or Aluminium Oxide, Al2O3 is a major engineering material. It offers a combination of good mechanical properties and electrical properties leading to a wide range of applications.
Alumina can be produced in a range of purities with additives designed to enhance properties.
A wide variety of ceramic processing methods can be applied including machining or net shape forming to produce a wide variety of sizes and shapes of components. In addition, it can be readily joined to metals or other ceramics using metalizing and brazing techniques. Applications would be Semiconductor insulators, wear resistance components, and anything requiring superior mechanical, electrical, and thermal properties
Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, high-strength ceramic material is used as an alternative to stainless steel, super alloys, tungsten carbides and first-generation ceramics such as Al2O3 and ZrO2.
It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials.
MACOR can be joined or sealed to itself and other materials using epoxy–metalized parts can be soldered, and brazing is used to join various metals to MACOR. Sealing glass produces a reliable tight seal that can be used for high vacuum environments. With a high maximum operating temperature (1000°C under no load, 800°C continuous loads) and the flexibility of intricate shaping/precision during manufacture; MACOR offers a higher grade solution to your technical industry’s requirements.
Mykroy shares many properties with MACOR, acting as a highly versatile solution to expensive ceramics, being a more cost-effective option for less heat dependant solutions.
High Dielectric Strength Low-Loss Factor Heat Resisting Non-Tracking, Low Expansion Co-Efficient, Strong and Rigid; does not creep or deform, unlike ductile materials, Low Thermal Conductivity; high-temperature insulator, Electrical Insulator, especially at high temperatures, Excellent with high voltages and a broad spectrum of frequencies, Zero Porosity, Radiation Resistant, No outgas in vacuum environments when baked out
| MYKROY MM500 | MACOR | |
| Binder Phase/ Binder type | Mica flakes | Mica flakes |
| Colour | Light Grey | White |
| Typical Applications | Low thermal conductivity and electrical properties. Does not burn or outgas, a cheaper alternative to Macor for high temperature work. | Low thermal conductivity, radiation resistance, can also be metallised. A more expensive but versatile material than Mykroy. |
| Mechanical Properties | ||
| Flexural strength | 86.2 MPa | 94 MPa |
| Young Modulus (Modulus of Elasticity) | 82.7 GPa | 66.9 GPa |
| RT Compression | 345 MPa | 345 MPa |
| Open porosity | 0% | 0% |
| Density (g/cc mm2) | 2.7 | 2.52 |
| Hardness | 90 / 46 Hv | 250 Knopp |
| Thermal Properties | ||
| Thermal conductivity @ 25 deg C W/mK | 1.15 | 1.46 |
| Coeff Thermal Expansion (10^-6) | ||
| @ 25°C – 11.57 x 10^-6 | @ -100-25°C – 81 x 10^-7 | |
| @ 350°C – 10.53 x 10^-6 | @ 25-300°C – 90 x 10^-7 | |
| N/A | @ 25-600°C – 112 x 10^-7 | |
| N/A | @ 25-800°C – 123 x 10^-7 | |
| Specific heat at 25°C J/gK | 0.12 | 0.79 kJ/kg°C |
| Max Temp Oxidising / Inert | 500°C | 800°C – 1000°C |
| Electrical Properties | ||
| Dieletric constant, 25°C | 6.9 @ 1MHz | 6.01 @ 1KHz 5.64 @ 8.5GHz |
| Dielectric strength Kv/mm | 20.9 | 45 |
| RT resistivity (ohm.cm), 25°C | >10^14 | 10^17 |
Material | Approximate Weight |
| Silicon – SiO2 | 46% |
| Magnesium – MgO | 17% |
| Aluminium – AL2O3 | 16% |
| Potassium – K2O | 10% |
| Boron – B2O3 | 7% |
| Fluorine – F | 4% |
At Thermic Edge, we pride ourselves on being at the forefront of the Vacuum Heating Technology Industry. We provide a complete service, our bespoke and versatile ranges give you the tools necessary for any inert, HV or UHV application.
This website uses cookies to ensure you get the best experience. Please see our Privacy Policy for more information.